Capabilities

Here is a brief list of our capabilities:

Mixed Signal ASIC Design:: We have developed several Mixed-Signal ASICS used in processing low level signals with high environmental noise tolerance. We use micro-power, low voltage CMOS processes with supply voltages as low as 1.2 Volts.; Our principal Mixed Signal ASIC Designer has 20 years of analog and digital hardware design experience, and has designed several mixed-signal ASICS which are currently in high volume production.

Digital ASIC Design:: Our Digital ASIC Designers are experienced in high speed CMOS designs using VHDL/VERILOG and SPICE development tools. They have years of experience working for companies such as Lattice Semiconductors and Tektronix.

Digital Signal Processing:: Our Hardware Engineers have designed DSP systems using TI, Motorola, and Analog Devices DSP Chips. Our principal DSP Engineer has 13 years of experience developing algorithms for signal processing and waveform recognition used in medical diagnostic applications.
Electronic Hardware Design:: We have several Electronic Hardware Engineers with a broad range of expertise in Analog and Digital hardware design. They have developed products for Medical Electronics, Robotics, Aero-Space, Security System, and Control System Applications.
Mechanical Design:: Our Mechanical Engineers come from companies such as Tektronix and Mercedes Benz. They have years of experience designing plastic and metal enclosures and mechanisms. They are experienced in using a variety of Mechanical CAD tools, such as Pro-E, Solid Works, CAD-Key, etc.
Software Design:: We develop software for embedded and PC applications. We have developed embedded software for processors ranging from small 8-bit devices with 2K of internal ROM, to 32-bit RISC processors. Our Software Engineers are fluent in assembly language for several processors, C, C++, Pascal, LISP, BASIC, FORTRAN, Visual BASIC, etc. and have written for embedded applications, as well as Unix, Windows (9x & NT), MS-DOS, OS-9, and Macintosh platforms.

PCB Layout:: Our principal PCB Designer has over 25 years of experience laying out high density fine-line (2 mill traces and spaces) multi-layer boards, and Ceramic Hybrids. These boards are used in Medical, Telecommunication/RF, and PC applications, and utilize Chip On Board, and Multi Chip Module technologies.